Effect of nano Al2O3 additions on the microstructure, hardness and shear strength of eutectic Sn-9Zn solder on Au/Ni metallized Cu pads
نویسندگان
چکیده
0026-2714/$ see front matter 2010 Elsevier Ltd. A doi:10.1016/j.microrel.2010.06.013 * Corresponding author. Tel.: +852 2788 7130; fax: E-mail address: [email protected] (Y.C. Chan Nano-sized, nonreacting, noncoarsening Al2O3 particles have been incorporated into eutectic Sn–Zn solder alloys to investigate the microstructure, hardness and shear strength on Au/Ni metallized Cu pads ball grid array substrate (BGA). In the plain Sn–Zn solder joint and solder joints containing Al2O3 nano-particles, a scallop-shaped AuZn3 intermetallic compound layer was found at the interfaces. In the solder joints containing Al2O3 nano-particles, a fine acicular-shaped Zn-rich phase and Al2O3 nano-particles were found to be homogeneously distributed in the b-Sn matrix. The shear strengths and hardness of solder joints containing higher percentage of Al2O3 nano-particles exhibited consistently higher value than those of plain solder joint and solder joints containing lower percentage of Al2O3 nano-particles due to control the fine microstructure as well as homogeneous distribution of Al2O3 nano-particles acting as a second phase dispersion strengthening mechanism. The fracture surfaces of plain Sn–Zn solder joints exhibited a brittle fracture mode with smooth surfaces while Sn–Zn solder joints containing Al2O3 nano-particles showed a typical ductile failure with very rough dimpled surfaces. 2010 Elsevier Ltd. All rights reserved.
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